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Bonds which have been mutilated or defaced or which have been lost or destroyed may be replaced as provided, respectively, in Article 2 (commencing with Section 53430) or Article 3 (commencing with Section 53460), Chapter 3, Part 1, Division 2, Title 4 of the Government Code, or as provided in the resolution authorizing their issuance.
(Added by Ord. 225-81, App. 5/5/81)
Bonds and coupons which have been paid may be destroyed in the manner provided in Article 11 (commencing with Section 53920), Chapter 4, Part 1, Division 2, Title 4 of the Government Code, or as otherwise ordered by resolution or ordinance of the Board.
(Added by Ord. 225-81, App. 5/5/81)
Payment of all, or any portion, of any assessment levied to pay the principal or interest due, or to become due, on the bonds of any district formed under this Procedure Code may be made with matured bonds or matured coupons of such district. Such bonds and coupons shall be accepted and treated as cash, and when so received shall be cancelled; and the interest and sinking fund of such district shall be credited with the face value thereof.
(Added by Ord. 225-81, App. 5/5/81)
In the event of a surplus remaining in the redemption fund after payment of the entire principal and interest on all bonds issued under any plan mentioned herein, for retirement of which such fund shall have been established, such surplus shall, subject to any other special provision herein therefor, be applied first to repayment to the City of any balance due it for contributions and advances which it may have made to the redemption fund and of any special levies which it may have undertaken in aid thereof other than any regular annual assessments levied to retire any such bond, and of any monies due it for costs incurred or charges allowed, together with interest on such sums at the rate mentioned in such bonds. The excess, if any, shall be paid into the general fund of the City.
(Added by Ord. 225-81, App. 5/5/81)
SUBDIVISION 2
BOND PLAN A-LOT BONDS
BOND PLAN A-LOT BONDS
The bond provisions of the Improvement Act of 1911, as such provisions may be amended from time to time, are incorporated in and made a part of this Subarticle. When bonds are issued pursuant to this Plan, except as otherwise provided herein, said provisions shall apply.
(Added by Ord. 225-81, App. 5/5/81)
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