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2703.2 Devices, equipment and systems.
Devices, equipment and systems including, containers, piping, tubing, valves and fittings shall comply with the requirements of this section, FC 5003.2, and other applicable provisions of this code, and the construction codes, including the Building Code and the Mechanical Code.
2703.2.1 Additional regulations for HPM supply piping and tubing.
The requirements set forth in FC 5003.2.2.2 shall apply to supply piping and tubing for HPM gases and liquids. Supply piping and tubing for HPM gases and liquids having a health-hazard ranking of 3 or 4 shall be welded throughout, except for connections located within a ventilated enclosure if the material is a gas, or an approved method of drainage or containment is provided for connections if the material is a liquid.
2703.3 Design and installation requirements.
Semiconductor fabrication facilities shall be designed and installed in accordance with FC 2703.3.1 through 2703.3.9.
2703.3.1 Fabrication areas.
Design, installation and location of fabrication areas shall comply with the requirements of the construction codes, including the Building Code.
2703.3.2 Pass-throughs in exit access corridors.
Pass-throughs in exit access corridors shall be constructed in accordance with the construction codes, including the Building Code.
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