(a) Backflow prevention devices required by these rules and regulations shall be installed at a location and in a manner approved by and at the expense of the water consumer. In addition, any backflow prevention device required by Section 917.07 (b) and 917.07 (c) of these regulations shall be installed at a location and in a manner approved by the Director of the Ohio Environmental Protection Agency as required by Section 6109.13 of the Ohio Revised Code.
(b) Backflow prevention devices installed on the service line to a consumer's water system shall be located on the consumer's side of the water meter, as close to the meter as is reasonably practical, and prior to any other connection.
(c) Pits or vaults shall be of water-tight construction, be so located and constructed as to prevent flooding and shall be maintained free from standing water by means of either a sump and pump or a suitable drain. Such sump pump or drain shall not connect to a sanitary sewer nor permit flooding of the pit or vault by reverse flow from its point of discharge. An access ladder and adequate natural or artificial lighting shall be provided to permit maintenance, inspection, and testing of the backflow prevention device.
(d) Reduced pressure principle backflow prevention devices must be installed above ground level or floor level whichever is higher.
(e) The installation of any backflow preventer on a water service provides a closed system and some common problems may occur following the installation. Closed plumbing systems will not allow for thermal expansion of the water within the plumbing. When hot water heaters become activated, water will expand and can possibly increase the water pressure enough to activate the pressure relief valves on hot water heaters. If this problem does occur, the customer should be notified that for protection of the plumbing and the hot water heater, a special ball cock may have to be installed in their toilet tank or an expansion tank will have to be included into their plumbing system. Installation of either device will correct the thermal expansion problem.
(Ord. 1997-38. Passed 10-27-97.)